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  • About DOIT
  • Product
    • New Energy Industry
      •   Paste
      •   Anti-Friction Coating
      •   Greases
      •   Compound
      •   Dry Flim/Solid/Dispersions
      •   Sprays
    • Optoelectronics Industry
      • LED Application
        •   Die Attach Material
        •   Methyl Encapsulation
        •   Methyl-Phenyl Encapsulants
        •   Phenyl Encapsulants
        •   White Reflectivity
      • Display Applications
        •   Display module assembly
    • Semiconductor Industry
      • Semiconductor Package
        •   Die Attach
        •   Die Coating
        •   Filp Chip Package
        •   Thermal Management
        •   Innovative Solder Paste
        •   Epoxy Solder / Epoxy Flux
        •   EMI Shielding Materials
        •   Underfilling
        •   Lid / Holder / Heat spreader Sealing
  • Download Catalog
  • Contact
    • Contact Form
    • FAQs
  • Locations
  • ESG
    • SUPPORTS THE CHARITY SCREENING OF MELTING
    • 2022 ESG Report (EN)
    • 2022 ESG Report (CHIN)
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