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Showing 1–12 of 14 results

產品目錄
  • Application (42)
  • Optoelectronics Industry (17)
    • LED Application (17)
      • Die Attach Material (2)
      • Methyl Encapsulation (4)
      • Methyl-Phenyl Encapsulants (2)
      • Phenyl Encapsulants (7)
      • White Reflectivity (2)
    • Display Applications (0)
      • Display module assembly (0)
  • Semiconductor Industry (11)
    • Semiconductor Package (11)
      • Die Attach (8)
      • Die Coating (2)
      • Filp Chip Package (0)
      • Thermal Management (1)
      • Innovative Solder Paste (0)
      • Epoxy Solder / Epoxy Flux (0)
      • EMI Shielding Materials (1)
      • Underfilling (0)
      • Lid / Holder / Heat spreader Sealing (6)
  • New Energy Industry (14)
    • Dry Flim/Solid/Dispersions (0)
    • Sprays (0)
    • Paste (1)
    • Anti-Friction Coating (1)
    • Greases (8)
    • Compound (4)
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MOLYKOTE® 1000 PASTE PASTE BROWN

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MOLYKOTE® 111 COMPOUND DIMETHYL SI COMPOUNDS TRANSLUCENT

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MOLYKOTE® 33 LIGHT GRSE EC PHENYL SILICONE GREASES

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MOLYKOTE® 33 MED EXTREME LOW TEMPERATURE BEARING GREASE WHITE TO OFF WHITE

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MOLYKOTE® 4 COMPOUND ELECTRICAL INSULATING COMPOUND

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MOLYKOTE® 41 GREASE EXTREME HIGH TEMPERATURE BEARING GREASE BLACK

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MOLYKOTE® 44 MED GRSE PHENYL SILICONE GREASES OFF WHITE

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MOLYKOTE® 7 COMPOUND RELEASE WHITE TRANSLUCENT

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Anti-Friction Coating

MOLYKOTE® D 321 R SPRY ANTI-FRICTION COATINGS

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MOLYKOTE® EM 30L GREASE WHITE

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MOLYKOTE® EM 50L GREASE

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MOLYKOTE® G 4501 FM MULTI-PURPOSE SYNTHETIC GREASE OFF-WHITE

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© 2019 DOIT TECHNICAL CO., LIMITED All Rights Reserved
  • About DOIT
  • Product
    • New Energy Industry
      •   Paste
      •   Anti-Friction Coating
      •   Greases
      •   Compound
      •   Dry Flim/Solid/Dispersions
      •   Sprays
    • Optoelectronics Industry
      • LED Application
        •   Die Attach Material
        •   Methyl Encapsulation
        •   Methyl-Phenyl Encapsulants
        •   Phenyl Encapsulants
        •   White Reflectivity
      • Display Applications
        •   Display module assembly
    • Semiconductor Industry
      • Semiconductor Package
        •   Die Attach
        •   Die Coating
        •   Filp Chip Package
        •   Thermal Management
        •   Innovative Solder Paste
        •   Epoxy Solder / Epoxy Flux
        •   EMI Shielding Materials
        •   Underfilling
        •   Lid / Holder / Heat spreader Sealing
  • Download Catalog
  • Contact
    • Contact Form
    • FAQs
  • Locations
  • ESG
    • SUPPORTS THE CHARITY SCREENING OF MELTING
    • 2022 ESG Report (EN)
    • 2022 ESG Report (CHIN)
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