Optoelectronics Industry - Doit-Technical Website

Optoelectronics Industry

DOIT is an authorized distributor of high-performance optical-grade LED Encapsulants materials of DuPont™. We provide ultimate packaging solutions, including LED die attach, LED packaging materials,White reflectivity materials, and phosphor B-Stage, enhance LED process yield rates and competitiveness in the optoelectronics industry.

Mini LED

Suitable for general power applications, Mini LED has excellent stability and durability, which can provide products with higher flexibility processes.

LED Chip Scale Package (CSP)

The LED industry is still gradually reducing the size of components and packaging, requiring more light output on smaller chip areas.

LED Encapsulation Series

PLCC

Suitable for medium to high power applications, it has good thermal stability, excellent durability, and resistance to sulfur, making it suitable for various harsh working environments.

High Power and COB

Suitable for high power applications, it has excellent thermal stability and durability, which can improve product quality.

High Power Dome Lens

Suitable for high power applications, it has excellent thermal stability, durability, and good formability, which can provide products with higher flexibility processes.

LED Die Attach

Organic silicone adhesives have high strength, good workability, and low pollution. With excellent light stability, thermal stability, and high bonding strength over a wide temperature range.