DOIT Technical Co., Limited has tunkey soution for semiconductor lead-frame and substrate base pacakges. With technology forwarding, we have DuPont, Protavic, HJA, and Laird product lines to meet customers advance and high-end device package application. Our product line including whole stages package materials :

1. Die Attach (Insulated / Conductive)

2. Die Coating / Protection / Encapsulant

3. Thermal Management – TIM1 and Lid Sealing

4. Underfilling

5. Epoxy Solder and Epoxy Flux

6. Innovative Solder Paste

DOIT is the professional Distributor of LED/Semiconductor and electronics. To service for oversea and worldwide customers in time, we set up branch offices in Kunshan & Dongguan, China to provide on -time and win-win business system in 2019.

Semiconductor package technology is creative and innovative with challenge all the time. With turnkey solution and well semiconductor package knowledgement to solve the challenge supplier is the key factor to win in the market. We provides semiconductor package turnkey solution and Join Development next generation material with supplier and customers. DOIT is always your best partner ever.