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Home / Semiconductor Industry / Semiconductor Package / Lid / Holder / Heat spreader Sealing

DUPONT EA 6900

Insulation Adhesive, High temperature lidseal and heat sink attach adhesive designed for Pb-free reflow conditions such as 260C.

Marketing Application:SEMICONDUCTOR,OPTICAL COMPONENTS

Color:Gray

BRAND:DUPONT

Categories: Application, Lid / Holder / Heat spreader Sealing, Semiconductor Industry, Semiconductor Package Tags: DOW CORNING, OPTICAL, OPTICAL COMPONENTS, Semiconductor
產品目錄
  • Application (42)
  • Optoelectronics Industry (17)
    • LED Application (17)
      • Die Attach Material (2)
      • Methyl Encapsulation (4)
      • Methyl-Phenyl Encapsulants (2)
      • Phenyl Encapsulants (7)
      • White Reflectivity (2)
    • Display Applications (0)
      • Display module assembly (0)
  • Semiconductor Industry (11)
    • Semiconductor Package (11)
      • Die Attach (8)
      • Die Coating (2)
      • Filp Chip Package (0)
      • Thermal Management (1)
      • Innovative Solder Paste (0)
      • Epoxy Solder / Epoxy Flux (0)
      • EMI Shielding Materials (1)
      • Underfilling (0)
      • Lid / Holder / Heat spreader Sealing (6)
  • New Energy Industry (14)
    • Dry Flim/Solid/Dispersions (0)
    • Sprays (0)
    • Paste (1)
    • Anti-Friction Coating (1)
    • Greases (8)
    • Compound (4)
  • Description
  • Reviews (0)
ADDITIONAL INFORMATION

Color:Gray


Viscosity @25℃(mPa.s):405,600


Working Time(@25℃ /hr):168


Shelf Life (@-10℃ /Month):12M


Hardness(Shore):A65


Package:EFD30cc (35G/CRT),EFD55cc (70G/CRT)


Application:FCBGA


Cure condition:60Mins@60° C


Mixing Ratio:One Part


Specific gravity:1.33


Thermal Conductivity (Watts/meter℃):0.2


Glass transition temperature(Tg):<-40℃


Thixotropy index:2.6


SDS/TDS

Call for TDS, SDS or other technical information,TEL:+886-2-22901111

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  • About DOIT
  • Product
    • New Energy Industry
      •   Paste
      •   Anti-Friction Coating
      •   Greases
      •   Compound
      •   Dry Flim/Solid/Dispersions
      •   Sprays
    • Optoelectronics Industry
      • LED Application
        •   Die Attach Material
        •   Methyl Encapsulation
        •   Methyl-Phenyl Encapsulants
        •   Phenyl Encapsulants
        •   White Reflectivity
      • Display Applications
        •   Display module assembly
    • Semiconductor Industry
      • Semiconductor Package
        •   Die Attach
        •   Die Coating
        •   Filp Chip Package
        •   Thermal Management
        •   Innovative Solder Paste
        •   Epoxy Solder / Epoxy Flux
        •   EMI Shielding Materials
        •   Underfilling
        •   Lid / Holder / Heat spreader Sealing
  • Download Catalog
  • Contact
    • Contact Form
    • FAQs
  • Locations
  • ESG
    • SUPPORTS THE CHARITY SCREENING OF MELTING
    • 2022 ESG Report (EN)
    • 2022 ESG Report (CHIN)
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